● Hybrid model : Two milling configurations available
- Cross-section milling : smooth polishing of cross-section specimens for high resolution imaging of subsurface structures.
- Flatmilling : uniform polishing of surfaces as large as 5 mm with variable angle milling to selectively enhance specimen surface features.
● Higher Throughput : Improved milling efficiency
- Reduced cross-sectioning times with new ion gun design compared to previous E-3500 model. (Max.Milling rate: 300 µm/h for Si - 66% reduction in processing time)
● Removable sample stage unit :
- Removable sample stage unit for convenient specimen setting and cutting edge definition