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XSCAN-9860 2D/3D Hybrid Inspection System with Automation Technology

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Price : Call

Code: #23693

Supplier: XAVIS. Co.,Ltd

- 2D/3D Hybrid Inspection System with Automation Technology
- Precise results using high-speed OCT technology
- Built for user convenience
+ S/W, Table Size, etc. can be customized according to users and applications.

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rightMORE INFORMATION

  • APPLICATION FIELDS: 
    - Flip chip, memory, LSI bump, Wafer bump,... 
     
    FEATURES:
    - In-Line Bump Detection by Automatic Inspection Algorithm
    - High-Speed Oblique Computed Tomography Technology
    - 60° Oblique Angle & 360° around A FOV of interest
    - Open microfocus tube with transmission target
    - Tube Voltage Range : 10 ~ 160kV
    - Current Range : 50 ~ 1000μA
    - Max. tube power : 80W
    - Max. target power : 10W
    - Min. Detectability : 0.5μm
    - 160kV High-Tension Generator

  • Tube Type

    Open

    Focal Spot Size

    0.9um

    Output Power

    10W / 23W

    X-Ray Detector

    II or FPD

    Inspection Area

    30 x 260 mm

    Max. Sample Loading

    5kg

    X-Ray Leakage Dose

    ＜1uSv/hour

    Dimension

    (WxDxH mm)

    1900 x 3200 x 2200

    Equipment Weight(kg)

    6500kg

    Power Supply

    220 VAC Single phase 50/60Hz

    Remarks

    Fully Automatic System

  • - Minimizing End User’s Claim
    - Process Monitoring in Production line
    - Increasing Business Opportunity with High Quality Product
    - Saving Labor Cost
    - More Economical Inspection System
    - High Quality Product with 6Sigma

 

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