- Nano-focus Tube of 200 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.
- Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.
- Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.