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Laser Excimer LineBeam

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Code: #17725

System for excimer laser crystallization annealing applications.

LineBeam for Excimer Laser Annealing (ELA) of typically 50 nm to 120 nm thick amorphous silicon films on large flat panel display glass substrates was transferred into industrial production in the mid-1990s. This technique is progressing to even longer line beams for annealing larger areas, employing new excimer lasers with more and more pulse energy.

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Features:
- LineBeam Key Features
- Excellent Beam Profile Homogeneity
- Outstanding Optics Lifetime
- Display Industry Proven Technology; Large Installation Base Worldwide
- Standard Technology for Silicon Annealing Process (LTPS-LCD, OLED)
- - Accessories for LineBeam
- Micro Smoothing Device
- Short Axis Fine Tuner
- Beam Profiler
- Pulse Expander Module
- Beam Stabilization Unit
- Beam Symmetry Generator
- Short Axis Online Monitor
- CB E-Sigma Monitor
- P-Lens Entrance Monitor
- SB E-Sigma Monitor

LineBeam Model	LineBeam 465	LineBeam 750	LineBeam 1000	LineBeam 1300
Wavelength (nm)	308	308	308	308
Laser Pulse Energy (mJ)	1050	2000	4000	4000
Max. Repetition Rate (Hz)	600	600	600	600
Energy Density (mJ/cm²)	350	430	435	435
Line Beam Length (mm)	465	750	1000	1300
Line Beam Width (µm)	350	400	580	450
Long Axis Homogeneity (%, 2 sigma)	1.8	1.8	1.8	1.8
Short Axis Steepness (µm)	125	125	125	125
Depth of Focus (µm)	±150	±150	±120	±120

UV Processing Solutions	Wavelength (nm)	Beam Geometry	Approx. Beam Dimensions	Approx. Energy Density	Laser Options
UVblade	308	Line	(250-750 mm) x 0.3 mm	0.3 J/cm²	LEAP, LAMBDA SX
LineBeam	308	Line	(750 - 1300 mm) x 0.4 mm	0.4J/cm²	VYPER, TwinVYPER
VarioLas	193, 248, 308	Line or Rectangular	50 mm x 0.6 mm or 2 mm x 2 mm	0.2-5 J/cm²	COMPexPro, LPXpro
GeoLasPro	193	Round Spot	4-160 µm	1-45 J/cm²	COMPexPro

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Laser Excimer LineBeam

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