- Wide thickness measurement capability
- Enables film thickness (substrate thickness) measurements from 0.25 to 750 µm.
- Highly accurate thickness measurements
- Acquisition of precision data using a high-accuracy interferometer and high-throughput optics.
- Support for multi-wafer cassettes
- Optional automated cassette sampling system, enabling fully automated measurement for wafer cassettes.
- Simplified operating system
- Various conditions for measurement, mapping, and film thickness calculations are configured as preset recipes and managed in a recipe table. Measurement of film thickness is initiated by simply selecting a required method from the recipe table and clicking the Measure button.