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Jasco UTS-2000 Film Thickness Measurement System

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Code: #14410

Supplier: JASCO International Co., Ltd.

The thickness of the epitaxial layer, substrate, etching (residual layer), liquid crystal cell gap, and other semiconductor layers dramatically impacts semiconductor device performance. Management of layer thickness during the manufacturing process is extremely crucial for production of large yields of stable devices.

rightMORE INFORMATION

  • - Wide thickness measurement capability
    - Enables film thickness (substrate thickness) measurements from 0.25 to 750 µm.
    - Highly accurate thickness measurements
    - Acquisition of precision data using a high-accuracy interferometer and high-throughput optics.
    - Support for multi-wafer cassettes
    - Optional automated cassette sampling system, enabling fully automated measurement for wafer cassettes.
    - Simplified operating system
    - Various conditions for measurement, mapping, and film thickness calculations are configured as preset recipes and managed in a recipe table. Measurement of film thickness is initiated by simply selecting a required method from the recipe table and clicking the Measure button.

  • Measurement method

    FT-IR interference method for film thickness measurements

    Measurement configuration

    Reflection, Transmission (option)

    Objectives

    Near infrared: Lens objectives (4X) and Cassegrain objectives (15X, 30X)
    Mid-infrared: Cassegrain objectives (15X, 30X)

    Focus mechanism

    11 mm stroke

    Sampling area

    20 x 20 to 1200 x 1200 µm

    Sample positioning

    Verification of measurement area using an integrated CCD camera

    Measurement range/accuracy

    Film thickness

    0.25 to 750 µm (for Si)

    Reproducibility

    ±0.005 µm or less (for Si with identical measurements)

    XY stage

    Stage movement

    200 x 200 mm (Other options available)

    Minimum step size

    2 µmm

    Data processing unit

    Operating System

    Windows 7 Professional

    System control

    JASCO Spectra Manager software; Optics and X-Y stage control; Wafer cassette system control (option)

    Table

    Type

    Integrated vibration isolation table

    Dimensions

    1400 x 850 x 1025 mm (excluding protrusions or optional cassette loading system)

    Power requirement

    300 VA

 
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