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Advanced 3D Solder Paste Inspection System (SPI)

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Code: #15765

Supplier: CÔNG TY TNHH ARIATEC

V310i Advanced 3D Solder Paste Inspection System (SPI) soluton. The V310i Series offers powerful technologies and high throughput productivity for SMT production line.

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rightMORE INFORMATION

  • Board Dimensions

    V310i

    Maximum board size (Single Lane)

    -

    Maximum board size

    510 mm by 510 mm (20 inch by 20 inch) with 2 projectors

    Minimum board size

    50 mm by 50 mm (2 inch by 2 inch)

    Maximum board thickness

    4 mm (0.16 inch)

    Minimum board thickness

    0.5 mm (0.02 inch)

    Board weight

    Up to 3kg (6.6lb)

    Maximum inspected area

    503 mm by 510 mm (19.8 inch by 20 inch) with 2 projectors

    Clearance

    		  

    Top side of board

    15 mm (0.6 inch)

    Bottom side of board

    50 mm (1.96 inch)

    Minimum edge clearance

    3.5 mm (0.14 inch)

    Maximum PCB Warpage

    ±5mm

    Conveyor height range

    856 mm to 965 mm (33.7 inch to 37.9 inch)

    System Dimensions

    		  

    Footprint

    W: 1060 mm (3.5 ft) x D: 1352 mm (4.4 ft) x H: 2028 mm (6.7 ft)

    Weight

    ~750 kgs

 

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